Description
This Polyimide (PI) Tape with Release Liner from TAPESCI is engineered for high-temperature industrial applications, offering exceptional thermal stability, electrical insulation, and clean peel performance. The amber PI film base is paired with a protective release liner, ensuring easy handling, residue-free removal, and consistent unwinding during automated processes.
Ideal for:
– PCB solder wave masking
– Powder coating masking
– High-temp electrical insulation
– Gold plating protection
– Semiconductor manufacturing
