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ESD Pi Film Tape

ESD Pi Film Tape

@ESD Pi film tape is made of polyimide film with ESD additive to reduce the static charge single side coated with silicone glue (Antistatic Level: 10^6-10^9). It is used in applications as high as 280°C without glue and color residual.

– Color: Amber

– Thickness (mm): 0.05 | 0.055 | 0.06 | Custom

– Width (mm): From 1mm to 500mm | Custom

– Length (m): 33 | 50 | 66 | 100 | Custom

– Core Diameter(mm): 25 | 32 | 38 | 76 | Custom

– Packing Term: Label | OPP Bag | PVC Box | Carton | Custom

– Related Process: +Release Liner | Die Cutting | Custom

Kindly Note: Log roll and Jumbo roll are available.
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ESD PI Film Tape Description:

ESD PI Film Tape (Electrostatic Discharge Polyimide Film Tape) is a specialized adhesive tape made from polyimide film that provides both electrostatic discharge (ESD) protection and excellent high-temperature resistance. It is designed for use in electronics manufacturing, assembly, and testing environments where protection from static electricity is critical. This tape combines the heat-resistant properties of polyimide with the capability to safely dissipate static charges, making it an essential tool in industries that work with sensitive electronic components.

ESD Pi Film Tape Application:

1. Surface Protection for Electronics

  • Usage: Pi film tape is often applied to the surface of sensitive electronic components, such as semiconductor devices, integrated circuits (ICs), and circuit boards.

  • Purpose: Protects against electrostatic buildup during manufacturing or transportation, helping prevent damage that could lead to malfunction or failure.

2. ESD Safe Work Areas

  • Usage: The tape is used to secure equipment or work surfaces in ESD-safe zones.

  • Purpose: Ensures that work areas are free from static charge, which is critical when handling delicate electronic components, preventing potential damage during assembly or testing.

3. Masking for Soldering or Coating

  • Usage: Often used as a masking tape in PCB (printed circuit board) manufacturing processes, particularly during soldering or coating.

  • Purpose: The tape ensures that areas that need to remain free of solder or coating remain protected while the rest of the surface undergoes treatment.

4. Packaging of Electronic Components

  • Usage: Pi film tape is often used to seal packaging containing semiconductors, memory chips, or other sensitive devices.

  • Purpose: It helps in maintaining the ESD protection of components during storage and transit, reducing the risk of electrostatic discharge that can lead to performance degradation or failure.

5. Wire Bundling and Insulation

  • Usage: Can be used for bundling cables or wires in electronics, especially in high-density circuits.

  • Purpose: Provides insulation and reduces the chances of electrostatic buildup, which can be critical in automotive, aerospace, and other precision industries.

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